Lead Based Solder - Toxicology

Relevant Publications

Research Overview on the Electromigration Reliability of SnBi Solder Alloy.

Issue Release: 2024

Zinc Orthophosphate Can Reduce Nitrate-Induced Corrosion of Lead Solder.

Issue Release: 2024

Methanesulfonic acid (MSA) in clean processes and applications: a tutorial review.

Issue Release: 2024

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.

Issue Release: 2024

Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.

Issue Release: 2024

First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder.

Issue Release: 2024

The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy.

Issue Release: 2024

Hybrid solder joints: the effect of nanosized ZrO particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints.

Issue Release: 2023

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures.

Issue Release: 2023

Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.

Issue Release: 2023

Quality inspection of specific electronic boards by deep neural networks.

Issue Release: 2023

Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints.

Issue Release: 2022

Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization.

Issue Release: 2022

Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB.

Issue Release: 2021

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

Issue Release: 2021

A Low Temperature Soldered All Ceramic Lithium Battery.

Issue Release: 2021

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration.

Issue Release: 2021

Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress.

Issue Release: 2020

The concurrent decline of soil lead and children\'s blood lead in New Orleans.

Issue Release: 2019

A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders.

Issue Release: 2019

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